Automatic Vison Defect Inspection System

全自动晶圆缺陷检测系统

Features

  • Automatic loading & unloading (optional)
  • Automatically identify wafer code and generate the testing reports
  • Mark abnormal chips with InK (optional)
  • Customize defects size and AOI region
  • Software architecture platform, function modularization; highly adaptable
  • Detection parameters adjustable. Key parameters such as defect size and tolerance of different colors defined in each region can be adjusted through the interface or configuration file
  • Customize vision system: choose different hardware & software modules according to different precision requirements

Application

Recognize defects including dirt, scratches, abnormal size,  heterochromatic, line shortage, etc. Applicable for CMOS, semiconductor wafer and other machine vision related fields.

Specification
Minimum defect detection capacity 0.5µm
Wafer size 2"/6"/8"/12"
Automatic loading & unloading 50pcs

Note: All Information given here is reliable to our best knowledge. However, no responsibility is assumed for possible inaccuracies or omissions. Specifications and external appearances are subject to change without notice.

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Automatic Vison Defect Inspection System


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