- Automatic loading & unloading (optional)
- Automatically identify wafer code and generate the testing reports
- Mark abnormal chips with InK (optional)
- Customize defects size and AOI region
- Software architecture platform, function modularization; highly adaptable
- Detection parameters adjustable. Key parameters such as defect size and tolerance of different colors defined in each region can be adjusted through the interface or configuration file
- Customize vision system: choose different hardware & software modules according to different precision requirements
Recognize defects including dirt, scratches, abnormal size, heterochromatic, line shortage, etc. Applicable for CMOS, semiconductor wafer and other machine vision related fields.
|Minimum defect detection capacity||0.5µm|
|Automatic loading & unloading||50pcs|
Note: All Information given here is reliable to our best knowledge. However, no responsibility is assumed for possible inaccuracies or omissions. Specifications and external appearances are subject to change without notice.